Alchip Technologies, Ltd., a leading provider of silicon and design services for system companies developing complex ASICs and SoCs, recently showcased its accomplishments and plans for the future at TSMC’s 2024 Technology Symposium exhibit in Santa Clara, CA, and Workshop in Austin, TX. The company highlighted its expertise in high-performance computing design and its success in managing multiple complex projects.
At the event, Alchip engineers detailed their record-setting advanced package production, including CoWoS® designs on advanced nodes, high power levels, reticle interposers, and large packages in production. The company emphasized its strong industry partnerships, such as its involvement with TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance.
Alchip’s reputation as a high-performance ASIC leader is built on its expertise in advanced 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management. Customers of Alchip include global leaders in various electronic product categories.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies offers solutions for SoC design at mainstream and advanced process technology. This enables faster time-to-market and cost-effectiveness for system companies developing complex ASICs and SoCs. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661).
