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March 17 (Reuters) – Huawei Technologies Co Ltd’s (HWT.UL) founder mentioned that the organization has replaced extra than 13,000 components in its items that have been hit by U.S. trade sanctions, according to a transcript of a speech posted on Friday by a Chinese university.
According to the transcript posted by Shanghai Jiao Tong University, Huawei founder Ren Zhengfei mentioned Huawei had more than the previous 3 years replaced the 13,000 elements with domestic Chinese substitutes and had redesigned four,000 circuit boards for it items. He mentioned production of circuit boards had “stabilized.”
The remarks, which Reuters could not independently confirm, supplied a window into Huawei’s efforts to bounce back from U.S. trade restrictions. Considering the fact that 2019, Huawei, a significant supplier of gear utilised in 5G telecommunications networks, has been the target of successive rounds of U.S. export controls.
These controls reduce off each Huawei’s provide of chips from U.S. organizations and its access to U.S. technologies tools to style its personal chips and have them manufactured by partners. The Biden administration final year also banned the sale of new Huawei gear in the U.S.
Ren created the remarks in a speak to Chinese technologies authorities on Feb. 24, the university mentioned. The university posted the transcript on its web page on Friday. A U.S.-primarily based Huawei representative did not right away respond to a request for comment on Friday.
Ren mentioned Huawei invested $23.eight billion in R&D in 2022, and “as our profitability improves, we’ll continue to improve R&D spending.”
The reports come following analysts mentioned that Huawei showed off 5G telecommunications gear at an market conference in Barcelona in which all of the chips on its circuit boards had their origins obscured.
Reporting by Stephen Nellis in San Francisco and Krystal Hu in New York Editing by Cynthia Osterman
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