Alchip Technologies, a Taiwanese-based company specializing in high-performance ASIC design, showcased their recent achievements and future direction at the TSMC 2024 North America Technology Symposium in Santa Clara, CA, and Workshop in Austin, TX. The focus of their exhibit was on advanced technology and chiplet design plans.
At the booth, Alchip highlighted their expertise in complex ASIC design within the industry. They discussed their success with projects such as full reticle size designs over 800mm² on cutting-edge FinFET technology. Alchip engineers also showcased their advanced package production capabilities, including CoWoS® designs on advanced nodes, power levels exceeding 1000W, and packages larger than 70x80mm2 that are currently in production.
Alchip emphasized their strong industry partnerships, including their membership with TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance. They offer silicon design and production services for system companies developing complex and high-volume ASICs and SoCs. Their solutions provide faster time-to-market and cost-effective solutions for SoC design across various process technologies.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies has established itself as a leader in high-performance ASIC design through its expertise in 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management. Their customers include global leaders in AI, HPC/supercomputer, mobile phones, networking equipment, and other electronics. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661). For more information or to schedule a meeting with Charles Byers at Alchip Technologies please visit www.alchip.com or contact him at (408)-310-9244 or chuck_byers@alchip.com
