TSMC has announced its latest 1.6nm technology, A16, at the 2024 North America Technology Symposium in California. The Taiwan-based chip foundry plans to begin mass production using this new manufacturing process in 2026.
The A16 technology combines advanced nanosheet transistors with backside power rail solutions to enhance logic density and chip performance. Compared to the N2P process, A16 offers significant improvements such as an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and up to 1.1 times more density to support data center products. These advancements showcase TSMC’s commitment to pushing the boundaries of chip technology to meet the demands of the ever-evolving industry.
TSMC’s dedication to innovation and progress is evident in this groundbreaking technology, positioning the company as a leader in the global semiconductor market. The unveiling of A16 has generated much excitement within the tech community, as it is poised to revolutionize the semiconductor industry with its impressive performance enhancements and density improvements. The new standard for chip manufacturing processes set by A16 is expected to redefine what is possible in the world of semiconductors.
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